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Symposium III: Dry &Wet Etch and Cleaning

 Symposium Committee

Dr. Ying ZHANG
Chair

Applied Material, USA

Dr. Maxime Darnon
Co-Chair

French Institute for Scientific Research (CNRS), France

Dr. Yue Kuo
Co-Chair

Texas A&M Univ

Dr. Tom Ni
Member

AMEC, China

Mr. Jinrong Zhao
Member

North Microelectronics, China

Dr. Sebastian Engelmann
Member

IBM TJ Watson Research Center, USA

Dr. George Totir
Member

IBM T. J. Watson Research Center, USA

Mr. Masahiro Sumiya
Member

Hitachi High-Technologies Corp., Japan

Dr. Denis Shamiryan
Member

Global Foundries, USA

Dr. Steven Zhang
Member

SMIC, China

  Dr. Kaidong Xu
  Member

 IMEC, Belgium

Symposium III: Dry &Wet Etch and Cleaning

  • Advanced FEOL etching
    -           Polysilicon/ metal/ high-k gate stack etching, gate first and replacement gate integration schemes
    -           3Dgate stack etching for FinFET, tri-gate device
    -           Spacer etching
    -           CD and LER/LWR control

  • Advanced interconnect etching, MOL/BEOL etching
    -           Contact, CA and self-aligned CA patterning and etching
    -           Etching of low-k dielectric materials
    -           Low-k and ultra low-k trench-via patterning, mask opening, CD, profile control, damage cleaning
    -           Self-aligned via (SAV) etching for metal hardmask dual-damascene scheme.
    -           LWR control

  • Etching challenges for advanced 193nm immersion lithography and advanced double exposures and double etching integrations
    -           Advanced photo resist trimming and etching
    -           Etching challenges for tri-layer mask integration schemes

  • Interactions of plasma and other treatments with photoresists
    -           The fundamentals of surface interactions of plasmas and photoresists
    -           Advanced photoresist treatment for the enhancement of pattern transferring

  • Plasma Processing for 3D Integration, TSV and MEMS/NMES

  • Advanced memory etching and patterning
    -           Advanced memory materials
    -           DRAM, eDRAM, Flash memory
    -           Advanced nonvolatile memory, such as MRAM, PCM, and other new memory devices

  • Advanced plasma sources and process control

  • Photo resist stripping and clean

  • Post plasma treatment cleaning

  • Wet etching and cleaning
     

 

 

 

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