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Richard was the Director of Dry Etch Department at Intel Dalian Technology Development Center. As one of the founding members of NAND TD center, he had lead TD team successfully delivered industry-first 144T QLC technology and transitioned into manufacturing. He has lead technology roadmap planning for all process areas and driven several industry leading etch process technology in Gen 5 & Gen6 3D NAND. Prior to Intel, Richard had various technology and management positions at Lam Research, delivered first two generation 3D NAND HARC etch tools, logic atomic-layer etching tools and other new tool in atomic precision selective etch & surface treatment. He had also notable technology contribution to 45nm/28nm node dual work function metal gate deposition tools during his work at Applied Materials.
Richard received his B.E. in Chemical Engineering from Zhejiang University, and Ph.D. from University of California, San Diego, in Material Science & Engineering. Outside of work, he is active in professional association service and had served as executive director of CASPA and Chair of 2017 Annual Conference.
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