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Manish Ranjan 泛林半导体，先进封装客户运营，董事总经理 |
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个人简介 Manish Ranjan is the Managing Director for Advanced Packaging Customer Operations at Lam Research. He joined Lam in 2015 and is currently responsible for managing marketing, business development and business operations activities for various deposition, etch and clean products in advanced packaging market segment. Prior to joining Lam, Manish was the Head of Advanced Packaging and Nanotechnology segment at Ultratech Inc where he was responsible for managing all aspects of product, business and market development for lithography market segment. During his tenure at Ultratech, he led profitable market share growth to establish a dominant market share for the lithography product portfolio. He also worked at Lucent Technologies as the Product Technology Manager in the Analog Product Business Unit where he managed technical and business issues related to flip chip and WLP technology development. Manish has received a Master of Science degree in Industrial Engineering from State University of New York at Binghamton. He has also received a Master of Business Administration from The Wharton School of Business in Philadelphia. 摘要 Growth in the semiconductor industry is now driven by consumers who demand superior performance along with a thin profile for leading-edge devices. While improvements in semiconductor device performance can be achieved with traditional front-end scaling technology, it is widely expected that packaging technology will play a key role in meeting the next generation form factor and technical requirements. This presentation will discuss novel packaging schemes along with the increasing importance of heterogeneous packaging solutions for future devices, including key technical advances enabled by Lam Research for meeting next-generation production requirements in a cost-effective manner. |
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