超越摩尔技术论坛2014

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Since the early 70’s, the semiconductor industry ability to follow Moore’s law has been the engine of a virtuous cycle: through transistor scaling, one obtains a better performance-to- cost ratio of products, which induces an exponential growth of the semiconductor market. This in turn allows further investments in semiconductor technologies which will fuel further scaling. The industry is now faced with the increasing importance of a new trend, “More than Moore” (MtM), where added value to devices is provided by incorporating functionalities that do not necessarily scale according to "Moore's Law“.

Applications like Sensor, High Power, High voltage, LED driver, Automotive, Internet-of- things, RF, mmWave make developing novel MtM technologies on top of the Moore's Law technologies a more important issue. That's what gave rise to MtM, which is symbiotic with Moore's Law and allows non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC).

In conjunction with SEMICON China 2014, SEMI China will organize “More than Moore Technology Forum”, which focuses on "Internet-of-Things Application driven MtM innovation". This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers of China local IC industry.

MEMS/Sensor Technologies
RF/mmWave Technologies
CMOS image sensors
High voltage, High Power, LED driver
IP Needed in More than Moore world

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Oral Presentation Materials ：
SCC 2014 PPT Template

Conference Host	Dr Yumin LU, VP of technology, SITRI
8:00 - 8:20	Registration
8:20 - 8:30	Opening Remark
8:30 – 9:00	Risks and Strategies for IP Protection in Semiconductors
	Shaobin Zhu Attorney-at-Law, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP Download
9:00 – 9:30	The MEMS sensors integration path
	Leopold Beer Regional President Asia Pacific, Bosch Download
9:30 – 10:00	Manufacturing Technology of High Voltage Power Devices and its Challenges
	Dr. Sheng'an Xiao Senior Director of Advanced Modules, HHGrace Download
10:00 – 10:30	TowerJazz - The Global specialty Foundry Leader
	Dani Ashkenazi Vice President of Sales for APAC & Israel, TowerJazz Download
10:30 – 11:00	Altis helps you build the new generation of IoT applications
	Javen Tan Director, APAC and Japan, Altis Semiconductor Download
11:00 – 11:30
	Qixing Liu Director, ASMC
11:30 – 12:00	Wafer Level SiP Technology - Full 3D Architecture for Future Sensors
	Albert Ou Director, Corporate R&D, ASE Group
12:00 -12:10	Closing and lucky draw (Huawei P6S Smart Phone)

Mr. JY Zhang
Tel: 86-21-60278556
Email: [email protected]

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: [email protected]