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March 20-22, 2019
Shanghai New International Expo Centre

Workforce Development Tutorial

Advanced Memory Technologies: 3D NAND, DRAM and 3D X-Point

Date: Tuesday, March 19, 2019
Time: 13:30 - 17:30
Venue: Shanghai International Convention Center


Package: advance wafer level package, system in package (SIP) and testing

Date: Tuesday, March 19, 2019
Time: 13:30 - 17:30
Venue: Shanghai International Convention Center