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Symposium VII: Packaging and Assembly(CPMT APM Joint Symposium) 

 

(** to designate keynote talk, * to designate invite talk)

  

Sunday, March 13, 2016 Shanghai International Convention Center

Meeting Room5B+5C

 

Session I:  

Session Chair: Dr. Huili Fu

 

13:30-13:35

Opening Remarks

Dr. Steve Liang, JCET

 

**13:35-14:00

Advance in Semiconductor Packaging Technologies for IOT

Dr. Yifan Guo, ASE

 

**14:00-14:25

 

Patent issues of embedded fan-out wafer/panel level packaging

Dr. John Lau, ASM Pacific Technology

 

*14:25-14:45

 

Prospectus of Wafer Level 3D System Integration and Packaging Solutions beyond TSV

Dr. Herb Huang, SMIC

 

*14:45-15:05

Supercapcitor Materials for Energy Storage Applications

Prof. CP Wong, CUHK;SIAT

 

*15:05-15:25

Advanced Packaging Technologies for System Integration

Dr. Dongkai Shangguan, StatsChipPAC

 

15:25-15:40

Coffee Break

 

Session II:
Session Chair:
Dr. Yifan Guo

 

**15:40-16:05

Roadmap towards TSV-Free 2.5D Integration

Dr. John Yuanlin Xie, Altera Corp.

 

**16:05-16:30

Form Factor and Cost-Driven Advanced Package Substrates for Mobile and IoT Applications

Dr. Ken Lee, SIMMTECH

 

*16:30-16:50

 

Bridging the Gap between the Joint and the Board Level Tests for the Evaluation

 of Pad Cratering

Prof. Ricky Lee, HKUST

 

*16:50-17:10

Development of Fingerprint Sensor Module Assembly

Dr. Mark Huang, Suzhou Speed Semiconductor Technology Co. Ltd.

 

*17:10-17:30

Low Temperature Interconnection for Two PE; Printed and Power Electronics

Prof. K. Suganuma, Osaka University

 

 

Poster Session:

Coffee Break

Location: Foyer of Yangtze River Hall

Synthesis of Ultra-long Silver Nanowires and the Joining of Silver Networks

Shang Wang, Harbin Institute of Technology

Stretchable Conductors Based on In-Situ Polymerizde Poly(3,4-Ethylenedioxythiophene) and Three Dimensional Structure Design

Wangping Huang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Enhancement in light extraction of white LEDs using micro-cone patterned phosphor-in-glass

Simin Wang, Huazhong University of Science and Technology

Exploration of the role of available cellulose paper used for the flexible energy-storage system in supercapacitors

Leicong Zhang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Science

Morphology control of copper nanomaterials for IC bonding

Yanhong Tian, Harbin Institute of Technology

Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging

Yankang Han, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Printable and stretchable elastic composites with highly electrical conductivity based on core-shell fillers

Yougen Hu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Enhanced dielectric performance of PVDF composites with Graphene-BaTiO3 nanohybrids as fillers

Yunming li, Shenzhen Institutes of Advanced TechnologyChinese Academy of Sciences

Cure kinetics study of a Novel Die Attach Adhesive for High Power LED

Baotan Zhang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Enhancing the Conductivity of Electrically Conductive Adhesives by High-Temperature Short-Time Treatment of Silver Fillers

Chaowei Li, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences

3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity

Yaqiang Ji, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Fabrication of Flexible conductive composites based on copper nanowires

Yu Zhu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Digital micromirror lithography on MMIC manufacturing

Yore Jiang, Suzhou Delphi Laser Co., Ltd

Synthesis and application of novel fluorine based compound for organic light-emitting diode device

Fangfang Niu, Shenzhen University

Facile Synthesis of Oval Cu-Ag Bimetallic Nanoplates for Isotropous Electrically Conductive Adhesives

Yu Zhang, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences

Novel Preriodic mesoporous Organoslica the Film eith Low Dielectric Consians and high Mechanical property

Zhang Jiawei, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

A Fuzzy SVM for Intelligent Diagnosis of Solder Bumps Using Scanning Acoustic Microscopy

Mengying Fan, Jiangsu Normal University

Thermal simulation of conductive adhesive structures for EMC

Cheng Chen, Institute of Microelectronics of Chinese Academy of Sciences

EXPERIMENTAL PARAMETRIC STUDY ON THE BUMPING AND COINING OF GOLD STUDS FOR FLIP CHIP BONDING

Jeffery C. C. Lo, Center for Advanced Microsystems Packaging

Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene Based Barrier

Ye Hui, Shanghai University

Three-Dimensional Graphene foam for Highly Sensitive Pressure Sensors

Jinhui Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Luminescence properties and application of phosphor in glass by screen-printing technology for LED packaging

Xujia Xu, Wuhan University of Technology

Investigation of Epoxy Molding Compound with High Adhesion on Pd Plated Lead Frames

Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co., Ltd.

FORMATION OF COPPER@SILVER CORE-SHELL NANOPARTICLES

WITH EXCELLENT ANTIOXIDATION FOR INK-JET PRINTING

Qionglin Ouyang, Shenzhen Institutes of Advanced Technology, Chinese

Academy of Sciences, Shenzhen, China

 

 

Symposium VII A (Packaging and Assembly)
Monday, March 14, 2016  Shanghai International Convention Center
Meeting Room
5B+5C

Session I:

Session Chair: Dr. John Yuanlin Xie

 

**8:30-8:55

3D Packaging for Power Electronics Application

Dr. Daniel Shi, ASTRI

 

8:55-9:10

Thermal Simulation of Gallion Nitride Power Packages

Simon S. Ang, University of Arkansas

 

9:10-9:25

Miniaturization of System in Package for Wearable Devices using Copper pillar Solder flip chip Interconnects.

Kelvin Pun Po Leung, Compass Technology Co., Ltd

 

9:25-9:40

The World’s First “Low Temperature / Low Load” Damage Free  Flip Chip Technology Satisfying Various Chip Assembly Demands

Katsunori Maeda, ConnecTec Japan

 

9:40-9:55

Coffee Break

 

Session II:

Session Chair: Dr. Mark Huang

 

**9:55-10:20

 

Development of 3D WLCSP Using Vertical Via Last TSV Technology

Dr. Daquan Yu, Tianshui Huatian

 

*10:20-10:40

Dominant effect of diffusion anisotropy in β-Sn grain on electromigration behavior of SnAgCu solder bumps

Prof. M.L. Huang, Dalian University of Technology

 

10:40-10:55

C-SOI substrate enabling demanding MEMS sensors for smart system explosion

Jani Karttunen, Okmetic Oyj

 

10:55-11:10

Insights into the role of interface in the rheological property of underfill composites

Guo Qian, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

 

11:10-11:25

No-Clean Material for Advance Packaging Assembly

Lim Sze Pei, Indium Corporation

 

11:25-11:40

Vertical TSV Fabrication for Wafer Lever Chip Scale Packages

Mark Huang, Suzhou Speed Semiconductor Technology Co. Ltd.

 

11:40-13:30

Lunch Break

 

Session III:

Session chair: Prof. ML Huang

 

**13:30-13:55

MIS

YB Lin, JCET

 

 

13:55-14:10

Ultra Wafer Thinning and Dicing Technology for Stacked Die Packages

HAO LIU, Dongguan Ramaxel Memory Technology Limited.

 

14:10-14:25

High Throughput Thermocompression Bonding Enabled with a Flexible Manufacturing Platform

Horst Clauberg, Kulicke & Soffa Industries, Inc

 

14:25-14:40

Solving the challenges of outgassing substrates in advanced packaging applications such as UBM and RDL

Mohamed Elghazzali, Evatec AG

 

14:40-14:55

Coffee Break

 

Session IV:

Session chair: Dr. Tim Bao

 

**14:55-15:20

Automotive QFN Packaging Solution

Tan Boo Wei, R&D, Carsem

 

15:20-15:35

Fluxless Soldering in Activated Hydrogen Atmosphere

C. Christine Dong, Air Products and Chemicals

 

15:35-15:50

Performance improvement through the polymer reduction

Sheng Guo, Advanced Micro-Fabrication Equipment Inc.

 

15:50-16:05

The development of ionic conductive polymers for packaging acnodic bonding materials

Du Chao, Taiyuan University of Science and Technology

 

16:05-16:20

Advances in Wire Bonding to Lower Package Cost and Improve Capability

Ivy Qin, Kulicke and Soffa Industries, Inc.

 

16:20-16:35

PHOTOLITHOGRAPHY STUDY FOR HIGH-DENSITY INTEGRATION TECHNOLOGIES

Masaki MIZUTANI, Canon Inc.

 

 

     

Symposium VII B (CPMT APM Joint Symposium)

Monday, March 14, 2016  Shanghai International Convention Center
Meeting Room: 5D+5E

Session I:

Session Chair: Dr. Tim Chen

*8:30-8:50

2D Heat Dissipation Materials for Microelectronics Cooling Applications

Prof. Johan Liu, Shanghai University; Chalmers University of Technology

*8:50-9:10

Dielectric and Fluidic Properties of Epoxy Molding Compound for BGA Packaging

Sean J. Fok, Tecore Synchem, Inc.

9:10-9:25

Sputtering conditions of Cu hillock formation for solid-state bonding

Sho Akutagawa, The Institute of Scientific and Industrial Research (ISIR), Osaka University

9:25-9:40

Directly Electroless-plating Ni-P Thin-film to Fabricate Magnetic Core of Integrated Inductor for Printed Circuit Board

Xiaolan Xu, University of Electronic Science and Technology of China

9:40-9:55

Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

Yilong Huang, Harbin Institute of Technology

9:55-10:10

Locally Reinforced Polymer-based Composites for Efficient Heat Dissipation of Multiple Heat Sources

Xiaobing Luo, Huazhong University of Science and Technology

10:10-10:25

Coffee  Break

Session II:

Session Chair: Xiaohua Tan

10:25-10:40

Fabrication of Copper Nanowire/Polyurethane Stretchable Conductors by a high intensity pulsed light method

Su Ding, Harbin Institute of Technology

10:40-10:55

Silver Bonding Wire for BSOB/BBOS

Zhi RenNiche-Tech Corporation Limited

10:55-11:10

Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration

Ning Zhao, Dalian University of Technology

11:10-11:25

A Facile Method to Transfer Vertical Aligned Graphene Film/Polydimethylsiloxane Composite to Thermal Interface Materials

Haoming Fang, Peking University

11:25-13:30

Lunch Break

Session III:

Session Chair: Prof. Yanhong Tian

*13:30-13:50

Study of Epoxy molding compound for Fingerprint Sensor

Takeshi Mori, Sumitomo Bakelite Co., Ltd.

13:50-14:05

Comparative study of anhydride-based and amine-based underfill materials for flip chip applications

Gang Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

14:05-14:20

Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging 

Andrew Shang, Center for Advanced Microsystems Packaging, HKUST

14:20-14:35

A new micro-silver paste for high power semiconductor devices

Jinting Jiu, Osaka University

14:35-14:50

A Facile Ultra Sound----Assisted Fabrication of Graphene Nanosheets----Silver Nanowires Hybrid nanomaterial And Their Application to Electrically to Electrically Conductive Adhesives

Yanqing Ma, Shihezi University

14:50-15:05

Research on Snsbni solder Joints between LED chip and heat sink

Wei Liu, PKUSZ

15:05-15:20

Measurement of DC and High Frequency Electrical Characteristics for TSV

Li Cheng, Institute of Microelectronics, Tsinghua University

15:20-15:35

Coffee Break

Session IV:

Session Chair: Dr. Guoping Zhang

15:35-15:50

Sintering behave of copper submicron particle paste for low temperature bonding

Gao Yue, Osaka university

15:50-16:05

Highly Efficient and Stable Quantum Dots Luminescent Microspheres for High-Performance White Light-Emitting Diodes

Kai Wang, South University of Science and Technology of China

16:05-16:20

Electrically Conductive Adhesives Based on Thermoplastic Polyurethane Filled with Carbon Nanotubes

Jie Luo, Suzhou Institute of Nano-tech and Nano-bionics, CAS

16:20-16:35

A NOVEL MECHANISM OF SILVER MICROFLAKES SINTER JOINING

Hao, ZHANG, Institute of Scientific and Industrial Research, Osaka University

16:35-16:50

Evolution of Joint Microstructure in 30um Pitch Flip Chip Package

Weihong Zhang, Nantong Fujitsu Microelectronics Co. Ltd.

 

 

 

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