Dr. Julian Hsieh
Dr. Julian Hsieh (謝主純) joined ASM International in 2009 and currently holds the position of Senior Director, Global Technologist with main responsibilities in developing advanced ALD process applications with leading edge customers to achieve superior device performance in advanced device architecture.
Prior to ASM, Julian worked for Novellus Systems, a leader in thin film process equipment, for over thirteen years, where he held various executive and management positions in product development and business unit management. His titles at Novellus included Sr. Director of PECVD and HDPCVD Product Management, VP/GM of Integrated Metals Business Unit, VP of Technology in Asia. He was instrumental in establishing leading edge process technologies, such as HDPCVD, PECVD FSG, BEOL Low-k, SiC ESL and ionized PVD for integrated copper barrier/seed, at Logic foundry customer sites in Asia.
Julian received his B.S. degree from National Taiwan University, and his MS/PhD in Chemical Engineering from the University of Florida. After graduation, he then spent 7 years at AT&T Bell Labs and IBM Research in Yorktown Heights, working on fundamental & theoretical thin film process technology topics. Julian has over 20 publications and holds 6 process technology patents.