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Symposium VII: Packaging and Assembly
 

(** to designate keynote talk, * to designate invite talk)

 

Sunday, March 16, 2014 Shanghai International Convention Center

Meeting Room:5H

Session I: Advanced Packaging Development

Session chair: Dr. Steve Liang

 

 

**13:40-14:10

The Challenges of the Package Technologies with the Progress of Wafer Process

 

Dr. Fu, Huili, Huawei, HiSilicon,China

 

 

**14:10-14:40

Enabling 3D Packaging Through Collaborative Innovation

 

Dr. Shangguan, Dongkai, NCAP,China

 

 

**14:40-15:10

Advanced MIS Packaging Development

 

Chow  Jimmy (or Lin YB), APS/JCET

 

 

*15:10-15:35

Copper Pillar Bumping Technology - the Promising Ecosystem Changer

 

 Asen Long, JCAP

 

 

15:35-15:50

Coffee Break

 

 

Session II: Packaging Applications

Session chairs: Dr. Tom Jiang/Dr. Daniel Lu

 

 

**15:50-16:20

Paper-thin 3D Organic Package Development and Its Commercialization

 

Prof. Kim, Sungjin, GT-PRC

 

 

**16:20-16:50

Ultrahigh Speed Transceiver Interconnect Design with Stacked Silicon Integration Technology

 

Dr. Shi, Hong, Xilinx

 

 

**16:50-17:20

Semiconductor Packaging Solutions in a Mobile World

 

Dr. Guo, Yifan, ASE Shanghai,China

 

 

*17:20-17:45

Flip Chip with Au Die Bumps Interconnected to Au Plated Substrate Used for Mobile Processors

 

Zhang, Tonglong, Nantong Fujitsu,China

 

 

Poster Session:

Meeting Room: Foyer of Yangtze River Hall

 

 

17:00-1830

Assembly Technology Development for RFIC Packaging
Xu Yupeng, Jiangsu Changjiang Electronics Technology CO.,LTD, China


 

High Performance QFN ICs Based on MIS and FC Packaging Technologies
Mike Liu, Jiangsu Changjiang Electronics Technology CO.,LTD, China

Innovation and New Applications of Traditional Power IC Packages
Henry Lee, Jiangsu Changjiang Electronics Technology CO.,LTD, China

Alumina-based White Die Adhesive for LED Die Bonding
Kwang-Cheol Lee,
 Korea Photonics Technology Institute, Korea


the study of low moisture molding compound
Chi Qiu, Jiangsu HHCK advanced materials Co., Ltd, China

Influence of coupling agent on the performance of epoxy molding compound
Hongjie Liu, Jiangsu HHCK advanced materials Co., Ltd, China

Study on Encapsulation Reliability

Guanhua LI, 'Shennan Circuits Co. Ltd.

Monday, March 17, 2014 Shanghai International Convention Center

Meeting Room: 5H

Session III: 3D Packaging

Session chairs: Dr. Roy Yu/Dr. Yishao Lai

 

 

**8:05-8:35

Perspectus of 3D Silicon Devices and System Integration Technology Opportunities Enabled by TSVBased Vertical Interconnect Solutions

 

Dr. Huang, Herb, SMIC

 

 

**8:35-9:05

Low Cost 3D IC Stacking Enabling High Performance FPGA SOC Integration

 

Dr. Xie, John, Altera

 

 

9:05-9:20

High-speed DIMM-in-a-Package (DIAP) Memory Module

 

Kevin Chen, Senior Director of Application Engineering, Invensas

 

 

9:20-9:35

PVD Copper Seed Queue Time Extension for 200mm TSV Application

 

Li Ming, Applied Materials China

 

 

9:35-9:50

Fabrication and Electrical Characterization of A Large Size TSV Interposer with Coarse RDL

 

Kai Xue, NCAP

 

 

9:50-10:05

Feasibility Study on MEMS Packaging Low Cost Solutions

 

Guirit, Lynn, CARSEM Suzhou

 

 

10:05-10:20

Coffee Break

Session IV: New Packaging Technologies

Session chairs: Dr. Mark Huang/Dr. Jing Shi

 

*10:20-10:45

Study on Two Types of Embedded Components in Substrate Technology

 

Ferlee Gunawan (Kunpeng Ding), SCC

 

 

*10:45-11:10

Enabling wafer processing for advanced interconnect technology

 

Markus Wimplinger, EV Group

 

 

*11:10-11:25

Software Development for Evaluation on Bond Pad Layout

 

Zheng Zhirong, Infineon Technologies (Wuxi) Co. Ltd

 

 

11:25-11:40

Accuracy and UPH challenges and solutions in flip chip underfill dispensing

 

Morita Akira, Nordson ASYMTEK

 

 

11:40-11:55

Copper BSOB on MCM Device

 

Tan Boo Wei & Ken Niu, Carsem Suzhou

 

 

11:55-13:35

Lunch Break

 

Session V: Packaging Materials Trends

Session chairs: Dr. Renzhe Zhao/Prof. Mingling Huang

 

*13:35-14:00

IC Substrate New Developments

 

Liang, Roger , Nanya

 

 

*14:00-14:25

Die Attech Adhesive Development Roadmap

 

Zhang, Eric, Hankel

 

 

*14:25-14:50

Development Trends and New Product Introduction of WB Wires

 

Sarangapani  Murali, Hearuss

 

 

*14:50- 15:05

The Challenges and Opportunities of Epoxy Molding Compound

 

Wei Tan, HHCK.China

 

 

*15:05- 15:20

Development of High Density 2 Layer Substrate Fabricated by MIS Process

 

Kong Haishen, Jiangsu Changjiang Electronics Technology CO.,LTD, China

 

 

15:20-15:35

Coffee Break

 

Session VI: Packaging Performance

Session chairs: Dr. John Xie/Young Do Kweon

 

*15:35-16:00

Electromigration Reliability of Lead-free Solder Interconnects

 

Prof.Huang,Mingliang, Dalian University

 

 

*16:00-16:25

Signal and Power Integrity for High-end Consumer Electronics

 

Song, Huawei, HiSilicon

 

 

*16:25-16:50

Performance Simulation Analysis for System-in-Package

 

Li Zongyi, JCET,China

 

 

*16:50-17:05

Open Test Platform for Optical Sensors in ODFN packages

 

 Liu Jian Gang,CARSEM Suzhou

 

 

*17:05-17:20

Application of Simulation in BEOL to generate Laser-Grooving compatible layout

 

LiuBo, SMIC

 

 

*17:20-17:35

PVD Systems for Advanced Packaging Applications

 

Peijun Ding, Beijing NMC Co., Ltd.

 

 

 

17:35-17:50

Cleaning in Electronics: Understanding Today’s Needs

 

P.J.Duchi, INVENTEC PERFORMANCE CHEMICALS

 


 
 

 

 

 

 

 

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