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Symposium VII: Packaging and Assembly

 

Sunday, March 15, 2015 Shanghai 2015 Shanghai New International Expo Center Meeting Room:5H

Session I:   Session chair: Dr. Steve Liang

**13:30-14:00

TBD
John Rowland ,Spreadtrum

 

*14:00-14:25

TBD
Li Zhang ,JCAP

*14:25-14:50

TSV Fabrication for Image Sensor Packaging
Mark Huang ,Speed

*14:50-15:15

Applications of synchrotron radiation real-time imaging technology in characterizing the reliability of micro bumps in electronic packaging
Mingliang Huang ,Dalian University of Technology

15:15-15:35

 COffee break

Session II:    Session chairs:

**15:35-16:05

Developing the Cost Effective High Bandwidth System Solutions Using Heterogeneous 2.5D integrations of Stacked Die Memory and FPGA
John Yuanlin Xie  Altera Corp.
 

**16:05-16:20

Advanced QFN -  No Lead Frame package technology
David Guo ,Jiangsu Changjiang Electronics Technology Co.Ltd

**16:20-16:35

Universal Copper Clip Packaging Solution For Power Management IC
Tan Boo Wei, Lily KhorCarsem Suzhou

*16:35-16:50

Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies

 

Daniel D. Evans, Jr ,Palomar Technologies

Poster Session:

Meeting Room: Foyer of Yangtze River Hall

17:00-1830

A novel method to remove wafer surface particle
Peng bo ,Freescale Semiconductor
Process Analysis on Sticky Wafer Issue
Liu Peng ,Freescale Semiconductor (China) Limited
Print Lead QFN package
Ping Wu ,Freescale Semiconductor (China) Limited
Prober Card Design Invention
Wang, Robert Q ,Intel
Improving Cu wire bonding process quality and robustness on PPF leadframes via an improved bonding tool
Ilan Langut ,Kulicke & Soffa, Bonding Tools Israel

 

 

Monday, March 16, 2015  Shanghai 2015 Shanghai New International Expo Center  Meeting Room: 5H

Session III:     Session chairs:Mark Huang

**8:30-9:00

Evolution of 3D Packaging: Challenges & Opportunities
Dongkai Shangguan ,NCAP

*9:00-9:15

An Empirical Study on SiP Assembly Quality & Reliability Crisis Settling and Further Improvement for Quality & Reliability Control System of Assembly House
Samuel Ye et alAvailink Inc.

*9:15-9:30

 Improvement for Quality & Reliability Control System of Assembly House

 

 Zheng Zhirong ,Infineon Technologies (Wuxi) Co., Ltd

9:30-9:45

The method of flexible printed circuit boards curing process parameters setting by use of finite element thermal simulation

 

 Barnett Silver,ATREG, Inc.

*9:45-10:00

 The Future of Assembly & Test: Convergence or Coexistence?

 

 Guofeng Xia ,Huatian Technology (Xi'an)Co.,LTD

10:00-10:15

Coffee Break

 

 

Session IV: Session chairs:

**10:15-10:45

 IOT and Associated Packaging Solutions
Yifan Guo ,ASE Shanghai
 

*10:45-11:10

Advanced MIS Technology Development
YB Lin ,JCET

11:10-11:25

 High Temperature Power Electronic Module Packaging
Simon S. Ang ,University of Arkansas
 

11:25-11:40

High-Volume-Manufacturing (HVM) of BVA? Enabled
Wael Zohni,Invensas

11:40-11:55

Innovative Ultra Fine Line Substrate with Bump for Semiconductor Package

  Nozomi Shimoishizaka ,Connectec Japan

11:55-13:35

Lunch break

Session V:      Session chairs: Mingliang Huang

**13:35-14:05

Prospectus of Emerging 3D Wafer  Level System Integration and Packaging
He Huang ,SMIC

*14:05-14:30

Wafer-Level 3D Integration by Low Temperature Wafer Bonding
V. Dragoi, J. Burggraf, N. Razek, B. Rebhan ,EV Group

14:30-14:45

Numerical Analysis on the Liquid Cooling of Microchannel Heatsink with Phase Change Material
Jer-Huan Jang ,Ming Chi University of Technology

14:45- 15:00

Multi Beam Full Cut Dicing of Thin Si Wafers
Jeroen van Borkulo ,ASM Laser Separation International (ALSI) B.V.

15:00- 15:15

Advanced Materials for Advanced Packaging
Yun Zhang,Shinhao Materials LLC

15:15-15:30

Coffee Break

Session VI: Session chairs:

*15:30-15:55

The Industrialization of MEMS Packaging Technology based on Laminate and Leadframe Substrate
Daquan Yu ,Tianshui Huatian

*15:55-16:10

Prober Card Design Invention
Wang, Robert Q,Intel

16:10-16:25

Silver Alloy Wire for IC Packaging Solution
Tan Boo Wei, Niu You Hua,Carsem Suzhou

16:25-16:40

Improving Cu wire bonding process quality and robustness on PPF leadframes via an improved bonding tool
Ilan Langut ,Kulicke & Soffa, Bonding Tools Israel

 

 

 

 

 

 

 

 

     

 

 

 

 

 

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