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Plenary Session

CSTIC 2016,  Sunday, March 13, 2016

SHICC Shanghai International Convention Center 
No.2727 Riverside Avenue Pudong, Shanghai 200120, China

08:45 – 09:35

Opening Ceremony,

 

Opening Remarks by Conference Chair

 

Opening Remarks by SEMI

 

Opening Remarks by ECS

 

Opening Remarks by Chinese Government Representatives

 

Presentation of ECS Best Student Paper Awards and SEMI Best Young Engineer Paper Awards

 

 

Meeting Room

3rd Floor Auditorium

 

 

09:35 – 10:20

 
ANDREA ONETTI
Group Vice President
General Manager of Volume MEMS & Analog Division
STMicroelectronics

 

 

10:20 – 10:40

Coffee Break

 

 

10:40 – 11:20


Dr. Chia-Hong Jan
Sr. Intel Fellow and director of system-on-chip (SoC) technology integration for the Technology and Manufacturing Group

The Day After 50 Years of Moore’s Law - Challenges, Prospects, and Opportunities

 

 

11:20 – 12:00

 

Qing Chu

Vice President,Huawei Technologies Co., Ltd.

 

 

12:00 – 13:30

7th Floor Grand Ballroom 1

 

 


 Panel Discussion

 Meeting Room: 3B

17:00-18:00           Main challenges in Finfet manufacture

Moderator: Dr. Cor Claeys

Panel Members: Dr. Ru Huang, Dr. Min-hwa Chi, Dr. Chia-Hong Jan, Dr. Shaofeng Yu, Dr. Huilong Zhu, Dr. Yang Pan

Parallel Symposium Oral Sessions 

Sunday, March 13, 2016

 

 

13:30 – 18:00

Parallel Symposium Oral Sessions

 

Coffee Break

 

Conference Poster Session

Monday,March14,2016

 

8:00-18:00

Parallel Symposium Oral Sessions

 

 

  

Joint Sessions

 

Symposium II and Symposium III-Lithograpy/Etch joint session 

Sunday, March 13, 2016

 

Shanghai International Convention Center

Meeting Room: 3H+3I+3J 

Session Chairs: Kafai Lai (IBM) and Ying Zhang (Applied Material)

 

 

13:30-13:35

Opening Remarks

 

Kafai Lai / Ying Zhang

**13:35-14:05

Moore's Law: No End in Sight

 

Vivek Singh, Intel

**14:05-14:35

Atomic Level Precision Materials Engineering

 

Peter Loewenhardt, Applied Materials

**14:35-15:05

Development of 250W EUV light source for HVM  lithography

 

Mizoguchi, Giaphoton

**15:05-15:35

Materials Innovation for Cost-Effective Lithography

 

Ralph Dammel, EMD / AZ

15:35-15:50

Coffee Break

 

 

 

 

Symposium II and Symposium XI-DTCO Joint session

 Monday, March 14, 2016

 

Shanghai International Convention Center

Meeting Room: 3H+3I+3J
Session chairs: Leo Pang / Yiyu Shi

 

 

*8:30-8:35

Opening Remarks

Leo Pang / Yiyu Shi

**8:35-9:05

Nanolithography and Design Technology Co-optimization in Extreme Scaling

David Pan, UT Austin

**9:05-9:35

Wearable &  Implantable Medical application – a  challenge to integrated RF transceiver design 

Zhihua Wang, Tsinghua University

**9:35-10:05

The Next Frontier in IC Design: Determining (and Optimizing) Robustness and Resilience of Integrated Circuits and Systems

Ulf Schlichtmann, Technical University of Munich

 10:05-10:20

Coffee Break

 
Symposium I: Device Engineering and Technology

Symposium II: Lithography and Patterning

Symposium III: Dry &Wet Etch and Cleaning

Symposium IV:Thin film and Process Integration

Symposium V: CMP and Post-CMP Cleaning

Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

Symposium VII: Packaging and Assembly(CPMT APM Joint Symposium)

Symposium VIII: Metrology, Reliability and Testing

Symposium IX: Emerging Semiconductor Technologies

Symposium X: Advances in MEMS and Sensor Technologies

Symposium XI: Circuit Design, System Integration and Applications

Symposium XII: Si Materials and Photovoltaic Technology
 

Conference Banquet

Sunday, March 13, 2016
Banquet fee



800RMB/Person
Online Registration link;
http://223.4.179.170/semi2016/Default.aspx

18:30 – 20:00Conference Banquet, SHANGHAI MIN (also called Xiao Nan Guo)(http://www.xnggroup.com)
Floor 7th, No.2727 Riverside Avenue Pudong, Shanghai



Hotel Floor Layout


 


 

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